EMI Shielding Clips (L4.4 / L6.5 Series)
L-shaped EMI shielding clips engineered for high-frequency electronic modules—including communication and IoT modules—supporting SMT assembly and over 50 cycles of repeatable installation and removal, balancing EMI shielding performance with assembly efficiency.
Highlights
- Supports SMT assembly and over 50 cycles of repeatable installation/removal
- Standard L4.4 and L6.5 dimensions, compatible with mainstream module footprints
- Substrate options: SPCC, SUS304, or C5191 phosphor bronze; surface finishes: nickel plating, tin plating, lead-free hot air solder leveling (HASL), or bare metal
- Co-developed with shielding cans to deliver complete EMI structural solutions
- In-house mold development and mass stamping in Dongguan—ensuring reliable lead times
Specifications
- Typical Dimensions
- L4.4 (length 4.4 mm), L6.5 (length 6.5 mm)
- Material Options
- SPCC, SUS304, C5191 phosphor bronze
- Surface Finishes
- Nickel plating, tin plating, lead-free HASL, bare
- Key Tolerances
- ±0.05 mm (length/width), flatness ≤ 0.08 mm
- Packaging
- Standard SMD carrier tape (8 mm or 12 mm width), 2,000–5,000 pieces per reel
In wireless communication devices (e.g., 4G/5G modules, Wi-Fi/BLE IoT modules, and smart terminal motherboards), electromagnetic interference (EMI) suppression is a critical step to ensure signal integrity and system stability. Traditional shielding cans require soldering for fixation, making maintenance difficult and occupying significant PCB area; in contrast, EMI shielding clips represent a structural innovation—featuring an elastic L-shaped body that enables rapid locking and reversible installation, significantly improving assembly efficiency and serviceability without compromising shielding performance.
Why do electronics solution providers choose custom EMI shielding clips?
Dongguan Zhuoyi Precision Hardware Co., Ltd. provides integrated services for mainstream specifications—including the L4.4 and L6.5 series EMI shielding clips—to module-level customers.Mold development + stamping mass productionUnlike standard off-the-shelf components, custom EMI shielding clips precisely meet the following requirements:
- Structural Compatibility: Adjust clip arm length, opening/closing angle, and spring-back force according to customer PCB cutout dimensions, pad layout, and shield can thickness;
- Process Compatibility: Meet mass-production requirements including SMT reflow (peak temperature 260°C), embossed tape packaging, and AOI inspectability;
Material & Surface Finish
: Standard base materials are SPCC/SECC; optional finishes include nickel plating, tin plating, or pre-tinning to ensure solderability and corrosion resistance;
Reliability Validation Support
: Support customers in completing insertion/removal cycle testing (≥50 cycles without plastic deformation), high-temperature/high-humidity storage (85°C/85% RH, 168 h), and vibration testing (10–2000 Hz).
Typical Application Scenarios
•Communication Modules: Used for localized RF front-end shielding, replacing full shielding cans to save routing space;
•IoT Modules: Compatible with miniaturized multilayer board structures, achieving reliable clamping within limited height (≤1.2 mm);
•POS Terminals / Industrial Control Motherboards: Maintain consistent clamping force under wide-temperature and vibration conditions, preventing EMI leakage due to loosening;
•Maintenance-Friendly Design: During repair, no hot-air rework station is required—simply remove the shield can directly, eliminating risks of PCB pad damage and component thermal damage.
Selection Reference Table
Model:Applicable Shield Can Thickness (mm); Clamping Stroke (mm); Recommended Installation Pitch (mm); Typical Material/Surface Finish
L4.4:0.2–0.3; 0.4–0.5; 8–12; SPCC + Tin Plating
L6.5:0.3–0.5; 0.5–0.7; 10–15; SECC + pre-tinned
Note: The above are general parameter benchmarks; actual specifications require structural feasibility analysis and tolerance optimization based on customer drawings or 3D models.