EMI Shielding Cans and Covers
Precision EMI shielding structural components engineered for high-frequency electronic devices such as communication modules and IoT modules. Available in single-piece, two-piece, and insulated-paint variants to meet SMT placement, reflow soldering, and high-consistency assembly requirements.
Highlights
- Drawing-driven customization with rapid response for non-standard structures
- Integrated mold development and small-batch prototyping support
- EMI-optimized base materials: stainless steel (SUS304), copper-nickel-zinc alloy (C7701), and Kovar alloy
- SMT-compatible design with legs validated for reflow soldering
- High dimensional stability: critical tolerances CPK ≥ 1.33
Specifications
- Typical Thickness
- 0.15–0.30 mm (adjusted per structural strength and shielding frequency band)
- Common Materials
- SUS304, C7701, Kovar
- Surface Finish
- Natural finish, nickel plating, conductive paint, insulating paint (selective area coating available)
- Compatible Processes
- SMT placement, reflow soldering, manual assembly
- Typical Shielding Frequency Range
- 30 MHz – 6 GHz (extendable based on design and material)
EMI Shielding Cans and Covers (also known as EMI shielding covers) are critical EMI shielding structural components in electronic devices, primarily designed to block external electromagnetic interference (EMI) from entering sensitive circuit areas while suppressing outward radiation of internal high-frequency signals—thereby ensuring signal integrity and operational stability of RF modules, baseband ICs, sensors, and other components.
Zhuoyi Precision’s EMI shielding cans and covers are precisely engineered to match PCB layouts and component heights; standardized leg structures ensure accurate positioning and reliable grounding. Can bodies can be customized into dome-shaped, rectangular, or irregular profiles per requirement, and support custom features including apertures, heat-dissipation holes, conductive coatings, and insulating paint application—balancing shielding effectiveness, thermal management, and assembly compatibility.
Typical application scenarios include:
• Communication modules: RF front-end isolation in 5G/NB-IoT/Wi-Fi modules;
• IoT modules: Regional segmentation and immunity design under multi-band coexistence;
• Smart terminal solutions: Shielding for LCM, Wi-Fi/BT chips on smartphone motherboards and tablet main control boards;
• Industrial electronic equipment: Complete system structures such as POS terminals and automotive T-Boxes that require explicit EMC certification.
We do not offer generic off-the-shelf models; all EMI shielding cans are structurally adapted and developed based on customer drawings or 3D models, with concurrent support for dedicated tooling design and small-batch prototyping validation. Standard materials include 0.2 mm thick stainless steel (SUS304), nickel silver (C7701), and Kovar alloy—selected for excellent electrical conductivity, solderability, and stamping formability. For SMT processes, leg suction-cup structures and planarity control are specially optimized to ensure high pick-and-place yield and coplanarity after reflow soldering.
As a precision metalworking partner for electronics solution providers, Zhuoyi Precision has consistently delivered EMI shielding structural components to multiple communication and IoT module manufacturers, covering the full lifecycle—from first-sample verification and mold commissioning to mass production delivery. All products undergo SPC process control; critical dimensions achieve CPK ≥ 1.33; surfaces are burr-free, scratch-free, and free of oxidation-related color variation, fully compliant with RoHS and REACH environmental standards.