EMI Shielding Can
Precision EMI shielding cans designed for high-frequency circuits in communication modules, IoT modules, and similar applications. Available in one-piece, two-piece, and insulated-paint variants to meet EMI shielding, mechanical fixation, and SMT assembly requirements.
Highlights
- Customizable per drawings or samples, covering one-piece, two-piece, and insulated-paint structural configurations
- Material options include Cu-C7521 (nickel silver), SUS304 stainless steel, and tin-plated steel strip (SPTE) to match varying soldering and strength requirements
- Leg coplanarity ≤ 0.05 mm; can flatness ≤ 0.08 mm — optimized for high-precision SMT placement
- Integrated capabilities in mold development and stamping mass production, with first prototype delivery in as fast as 7 days
Specifications
- Typical Thickness
- 0.15 mm, 0.20 mm, 0.30 mm (varies by structure and material)
- Common Materials
- Cu-C7521-O/H, SUS304R-1/4H, SUS304R-1/2H, SPTE (tin-plated steel strip)
- Surface Finish
- Natural finish, tin plating, or insulating paint coating (optional)
- Tolerance Standard
- GB/T 1804-m (medium grade); CPK ≥ 1.33 for critical dimensions
- Minimum Order Quantity (MOQ)
- Prototype order
EMI Shielding Can (also known as shielding cover or EMI shielding can) is a critical metal structural component in electronic devices, designed to block external electromagnetic interference (EMI) from entering sensitive circuits while suppressing outward radiation of internal high-frequency signals—ensuring stable operation of RF modules, Wi-Fi/BT modules, GPS units, and more.
Zhuoyi Precision's EMI shielding cans are custom-engineered to match actual electronic design operating conditions: leg height and coplanarity are precisely controlled; can flatness ≤ 0.05 mm; bend radius (R-angle) consistency is high—ensuring reliable pickup by SMT nozzles, zero warpage after reflow soldering, and zero-gap contact with PCB pads during assembly. Multiple structural configurations are supported, including movable legs, soldered legs, and snap-fit locking mechanisms.
Application Scenarios and Core Value
•Communication Modules: Compatible with 4G/5G LTE modules and Cat.1/NB-IoT modules; covers high-radiation areas such as main ICs, power amplifiers (PA), and filters;
•IoT Terminals: Meets compact spatial layout and multi-point grounding requirements under miniaturization and multi-layer PCB stacking;
•Smart Hardware: Enables zone-based shielding for LCMs, sensors, and wireless chips on motherboards used in smartphones, TWS earphones, and POS terminals.
Material and Process Selection Guidelines
Based on functional requirements and process compatibility, we offer the following mainstream combinations:
- Cupronickel (C7521): Excellent conductivity, good solderability, and superior heat dissipation—ideal for applications requiring reflow soldering; available in O-temper (soft, suitable for deep drawing) and H-temper (hard, suitable for bending);
Stainless Steel (SUS304)
: High strength, corrosion resistance, and cost efficiency—commonly used for shielding covers where welding demands are low and structural rigidity is prioritized; hardness grades include 1/4H (deep drawing) and 1/2H (bending);
Tinplate (Electrolytic Tin-Coated Steel)
: Cost-effective solution suitable for high-volume production of standard parts with low thickness (t = 0.15–0.2 mm);
Insulating Paint Treatment
: High-temperature-resistant insulating coating applied to the inner surface of the can to prevent short circuits with PCB components and enhance safety margin.
Why Choose Zhuoyi Precision for Custom EMI Shielding Cans?
•Synchronized Mold Development Capability: Full-cycle collaboration—from 3D structure review and DFM analysis to mold trial validation—aligned with customers’ new product development timelines;
•Rapid Prototyping in Small Batches: Laser cutting + bending prototypes available within 3–5 working days, reducing early-stage validation costs;
•Mass Production Consistency Assurance: Over 60 high-speed precision stamping presses + fully automated inspection lines; key dimensions CPK ≥ 1.33;
•End-to-End Service Support: Provision of material certification documents, RoHS/REACH compliance statements, packaging specification recommendations, and EMI grounding design consultation.
